JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. EIAJ EDA – Read more about eiaj, jeita and EIAJ ED ꞉ (EN) Enviado por Selvakpm Direitos autorais: © All Rights Reserved. Baixe no formato PDF ou leia online no Scribd.
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F saturation A ? Reference Because this test shall be performed under actual use condition essentially, this standard provided the ee-4702 test method is instead of actual use condition as similar as possible.
3-3 Standards Related to Reliability Test ｜Sanken Electric
A Ratio of Sweep: The axis of peel load shall be within 5 degree against riaj direction. In the case of the sampling method, actual device is mainly measured. The semiconductor devices ed-472 for the tests. R hardened steel or hard metal Remarks: However, if the wire cannot be hooked when the lead of specimen is very small, the strength of soldering joint shall be evaluated by push strength test for soldering joint. A new and old classification method is shown in Comment Table 1.
Lead wire terminal is to be bended to contrary direction and plate terminal to ordinary direction, both up to 90 degrees and then back to original position with same speed.
They are to be used e-d4702 the common standards of the company but the decision as whether a particular part is adopted or not is to be made by each division. In this case, the failure modes occurred not only with the soldering joint but also with bonding part breaking of the ICs.
In Figure 2, the leads are pulled up by turns and this operation raised up the package. But their values are not specified, because an actual stress is unknown in the process of actual fabrication.
JEITA / JEITA Standards / Electronic Devices Standardization / Semiconductor Devices Reliability
Test Board Design Guideline Appendix 2: The majority of the committee members said that it was learnt by experience that there is no doubt of the test result when stored at the maximum or minimum temperature for 7 minutes.
Therefore, the test specified in diaj standard shall not kk Note 1. IEC Ed 2. In particular, utmost attention should be paid to the precautions indicated in the detail specifications. The double circles indicate the eian present applications while the single circles indicate the assumed future applications.
This standard is specified of a bend stress of solder joint on a printed circuit board as a part of standard of a reliability test method.
It dose not mean the outline of the package. F Semi-sine Wave Bending of lead o. These test standards indicate the minimum levels of necessary quality and reliability to be applied to all the products of our company.
This phenomenon might affect to broken strength data. In-line evaluation methods and structural analysis methods for semiconductor devices Amendment1. For analysis of the test data, it is desirable to carry out the statistical process in Weibull distribution. The standards related to integrated circuits IC and separate volume Ed–4702 had been published, and the standards related to discrete devices SD separate volume Appendix and separate volume Appendix had been published.
Sharp-Reliability Test Standard for IC_图文_百度文库
The treatment which the specimens are submitted to before carrying out the initial measurements and tests. According to equations 12and 3acceleration factor AF of the two different conditions is given as follows: It also largely depends on the method of board process. Kouji Obinata Sony Corp.
ASoldering Heat Unless otherwise specified, Use below condition. Liquid ekaj 1 2 [Counting number of cycles] 30min. Taking into consideration such changes of the industry, it is decided to newly establish the environmental and endurance test methods for the semiconductor devices being mounted on the board.